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TECHNICAL DATA >
CAPABILITIES
SPECIFICATIONS
STANDARD
HIGH-TECH
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Base Material Used
FR4 – FR4 HiTg°
BT Epoxy - Polyimide -Teflon - INVAR - Halogen Free - Hi Frequence
BT Epoxy - Polyimide -Teflon - INVAR - Halogen Free - Hi Frequence
PCB Type
Rigid
Rigid - Rigid - Rigid/Flex (hybrid)
Rigid - Rigid - Rigid/Flex
(hybrid) (Teflon+Kapton)
Maximum Number of Layers
16
36 - 32 - 24
40 - 40 - 32
Maximum Board Dimension
570 x 449
640x570 mm
Maximum Board Thickness
3.2 mm
6.5 mm
Minimum core Thickness
0.1 mm
0.05 mm - 0.025 (Flex)
Base Copper Thickness
18 - 35 - 70 µ
9-12-18-35-70-105-140-210-305 µ
Aspect Ratio
8:1
24:1
30:1
Minimum Diameter Hole (Mechanical)
0.2 mm
0.15 mm
0.1 mm
Minimum Diameter Hole (Laser)
100 µ
75 µ
60 µ
Nickel Thickness on the Connector
> 4 µ
> 4 µ
Gold Thickness on the Connector
> 0.8 µ
> 0.8 µ
Holes Position Tolerance
± 0.1 mm
(from the board edge)
± 0.07 mm on PCB with diagonal
< 300 mm (from the board edge)
Minimum Trace
100 µ
75 µ
50 µ
Minimum Space
100 µ
75 µ
50 µ
Plated Hole Tolerance
-0.05 ÷ + 0.1 mm
-0.05 ÷ + 0.05 mm
Unplated Hole Tolerance
0 ÷ + 0.1 mm
0 ÷ + 0.1 mm
Conformity Certificate
On demand
On demand
Test Certificate
On all delivery
On all delivery
Controlled Impedance Certification
On demand
On demand
Production Date (week and year)
On solder mask On copper (on demand)
On solder mask On copper (on demand)
Certification
UNI EN ISO 9001:2008 - ISO TS 16949-2002 UL Certified: 94V-0 up to 130°
UNI EN ISO 9001:2008 - CNES – AS9100B EN9100:2003/S1 – JISQ9100:2004 UL Certified:
94V-0 up to 130°
ISO 14000
Routing Tolerance
± 0.2 mm
± 0.15 mm
Surface Finishes
H.A.S.L. - Lead Free H.A.S.L.
Electroless Gold
Electroless Tin - OSP
Electrolytic Ni - Electrolytic NiAu
Solder Mask Types
Photographic
Photographic
Legend
White
Different Colours
Electrical Test (short and open)
100.%
100.%
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