TECHNICAL DATA > CAPABILITIES

 

   
SPECIFICATIONS STANDARD HIGH-TECH NEXT STEP
Base Material Used FR4 – FR4 HiTg° BT Epoxy - Polyimide -Teflon - INVAR - Halogen Free - Hi Frequence BT Epoxy - Polyimide -Teflon - INVAR - Halogen Free - Hi Frequence
PCB Type Rigid Rigid - Rigid - Rigid/Flex (hybrid) Rigid - Rigid - Rigid/Flex
(hybrid) (Teflon+Kapton)
Maximum Number of Layers 16 36 - 32 - 24 40 - 40 - 32
Maximum Board Dimension 570 x 449 640x570 mm  
Maximum Board Thickness 3.2 mm 6.5 mm  
Minimum core Thickness 0.1 mm 0.05 mm - 0.025 (Flex)  
Base Copper Thickness 18 - 35 - 70 µ 9-12-18-35-70-105-140-210-305 µ  
Aspect Ratio 8:1 24:1 30:1
Minimum Diameter Hole (Mechanical) 0.2 mm 0.15 mm 0.1 mm
Minimum Diameter Hole (Laser) 100 µ 75 µ 60 µ
Nickel Thickness on the Connector > 4 µ > 4 µ  
Gold Thickness on the Connector > 0.8 µ > 0.8 µ  
Holes Position Tolerance ± 0.1 mm
(from the board edge)		 ± 0.07 mm on PCB with diagonal
< 300 mm (from the board edge)		  
Minimum Trace 100 µ 75 µ 50 µ
Minimum Space 100 µ 75 µ 50 µ
Plated Hole Tolerance -0.05 ÷ + 0.1 mm -0.05 ÷ + 0.05 mm  
Unplated Hole Tolerance 0 ÷ + 0.1 mm 0 ÷ + 0.1 mm  
Conformity Certificate On demand On demand  
Test Certificate On all delivery On all delivery  
Controlled Impedance Certification On demand On demand  
Production Date (week and year) On solder mask On copper (on demand) On solder mask On copper (on demand)  
Certification UNI EN ISO 9001:2008 - ISO TS 16949-2002 UL Certified: 94V-0 up to 130° UNI EN ISO 9001:2008 - CNES – AS9100B EN9100:2003/S1 – JISQ9100:2004 UL Certified:
94V-0 up to 130°		 ISO 14000
Routing Tolerance ± 0.2 mm ± 0.15 mm  
Surface Finishes H.A.S.L. - Lead Free H.A.S.L.
Electroless Gold
Electroless Tin - OSP		 Electrolytic Ni - Electrolytic NiAu  
Solder Mask Types Photographic Photographic  
Legend White Different Colours  
Electrical Test (short and open) 100.% 100.%  

 

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