TECHNICAL DATA > Multilayer PCBs

   
Elco produces both Homogeneous and Composite Rigid Multilayer PCBs
 
Homogeneous:
Rigid multilayer circuit boards composed of the same basic material

Composite:
Rigid multilayer circuit boards composed of different base materials

pdficon.png 		multilayer.jpg
 
   
TECHNICAL DATA
Construction
  • Up to 38 layers (under consideration of the maximum pcb thickness) Standard base copper thickness: 18 μm, 35 μm, 70 μm, 105 μm
Base Material
  • FR4 Std Tg 135°
  • FR4 Medium Tg > 150°
  • FR4 Hi Tg > 175°
  • Polyimide Teflon substrates (Special materials on request)
Dimensions
  • Maximum pcb size
  • 25.2" x 22.4" (640 x 570 mm)
PCB Thickness
  • Maximum pcb thickness: 0.26" (6.5 mm)
  • Minimum pcb thickness: 0.12" (0.3 mm)
Surfaces Finishing
  • Organic copper-passivation
  • Hot air levelling (HASL) (depends on thickness and size)
  • Electroless nickel/gold (NiAu)
  • Electroplated nickel/gold (NiAu)
  • Tin Lead reflow Other surfaces on request
Solder Masks
  • Screen printing of solder mask (uv-drying)
  • Peelable solder mask
Special Printings
  • Carbon
  • Marking print
Track Width/Space
  • Standard : 100 µm
  • High-Tech: 75 µm
  • Next step: 50 µm
Drill Diameter (mechanical)
  • Standard : 200 µm
  • High-Tech: 150 µm
  • Next step: 75 µm
Microvia Technology
  • (laser drilled blind via)
  • Standard Drill Diameter: 75 µm
  • Aspect ratio: ≤ 1
Contour Processing
  • Milled
  • Scored (contour or perforation)
Impedance Check
  • On request
  • Tolerance of impedance: ± 10 %
Tests
  • Automatic-Optical-Inspection (depending on layout and surface)
  • 100 % electrical test
  • Special check on request
  • Visual inspection
Quality Controls
  • Guarantee of custom-designed quality standards and production according to international guidelines:
  • Vision 2000 - CNES - AS9100B
  • EN9100:2003/S1 - JISQ9100:2004
  • UL Certified: 94V-0 up to 130°

Login