The process technologies implemented and the in-depth product knowledge have allowed Elco to increasingly make its name in the production of
Rigid-Flex printed circuit boards
of up to 20 layers.
TECHNICAL DATA
Construction
FR4 Std Tg 135°
FR4 Medium Tg > 150°
FR4 Hi Tg > 175°
Polyimide
Insulation Polyimide:
25 μm, 50 μm, 70 μm
Dimensions
Minimum pcb thickness: 0.26" (6.5 mm)
Maximum board Dimension: 25.2"” x 22.4" (640 x 570 mm)
Surface Finishing
Organic copper passivation
Hot air levelling (HASL)
Electroless nickel/gold
Electroplated nickel/gold Other surfaces on request
Solder Masks
Screen printing of solder mask (uv-drying)
Peelable solder mask
Special Printings:
Screen printing of solder mask (uv-drying)
Peelable solder mask
Track Width/Space:
Standard : 100 µm
High-Tech: 75 µm
Next step: 50 µm
Drill Diameter (mechanical):
Standard : 200 µm
High-Tech: 150 µm
Next step: 75 µm
Counter Processing:
Milled
Scored (counter or perforation) possibly with frame(delivery in rigid form)
Impedance Check
On request
Tolerance of impedance: ± 10 %
Tests
Automatic-Optical-Inspection
100 % electrical test
Special check on request
Visual inspection
Quality Controls
Guarantee of custom-designed quality standards and production according to international guidelines:
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